Development Milestones:

· 2021 – Became the first and, to this day, the only company in mainland China to launch a "full-series, full-domain, ultra-small-package" USB2.0 PC image controller chip (ranging from 300K to 21M pixels) as a practical, down-to-earth original manufacturer.

· 2023 – Became the first company in Asia to develop and bring eUSB2 chips to market.

· January 2024 – Successfully developed a 5-megapixel USB image controller chip with a package size of just 1.8mm × 4mm (smaller than a grain of rice).

· February 2025 – Launched an HD/720P USB image chip with an even smaller package size of 1.6mm × 3.5mm.

· By the end of 2025 – Cumulatively mass-produced over 60 mixed-signal chips that replace leading imported brands.

The company is committed to independent R&D, ownership of core technologies, and self-developed, controllable IP — all aimed at filling gaps in the domestic chip market. Over 70% of IcSpring's R&D team consists of top scientific talent from around the world. Its core engineers have 20 to over 30 years of experience, covering the entire product lifecycle from market-driven design to mass production.

IcSpring masters key SerDes technologies including PCIe, MIPI, USB2.0, USB3.1, HDMI2.0, HDMI2.1, DP1.4, GSML, and eUSB2, as well as ISP (image processing) technology. Its SerDes and ISP IPs are industry-leading in China. The company's self-developed chips are widely used in PCs and peripherals, smartphones and accessories, security, automotive, medical devices, artificial intelligence, robotics, and industrial applications.

Since its founding in 2008, IcSpring has been driven by relentless passion, bold innovation, and the spirit of "sipping ice water for ten years without ever letting the fire in the heart go cold" — striving to become a world-class, well-respected chip design company.

IcSpring Technology specializes in high-speed IC development and design as an All-in-one original manufacturer. Over 85% of our team members are R&D professionals, covering digital logic design, analog design, software development, system engineering, and physical design — forming a complete, closed-loop capability from foundational technology to system integration.Our core technologies span six key areas, built on a true All-in-one technology platform:

1. High-speed SerDes PHY design

2. High-performance analog circuit design

3. ISP (Image Signal Processing) design

4. Power management design

5. Audio design

6. System-on-Chip (SoC) integration

At the 28nm and 22nm process nodes, the company has invested substantial resources and talent in foundational R&D, design, and testing across SoC and AI chips. We provide customers with complete, comprehensive, and cost-effective All-in-one chip design solutions, and are ready to bring innovative, tailored IC products to market based on customer needs. To support this mission, we continuously strengthen our R&D, sales, support, and administrative teams, building a robust All-in-one technical support network that enables seamless collaboration with major manufacturers. Customers can communicate directly with our technical team to resolve issues quickly and gain valuable insights and application expertise. With persistence, dedication, and enthusiasm, we work closely with our customers to establish IcSpring as an All-in-one leading brand in chip design — both in China and around the world.

Ms.Yang 18676747814 Anny.yang@icspring.cn

TEL:0755-25780849 FAX:0755-25780427

ADD:Room 1304 Block A Building 8 Shenzhen International Innovation Valley Dashi Road Xili Community Xili Street Nanshan District Shenzhen